16 Layer Rigid Multi-layer PCB TG170 Impedance Control Circuit Board
Specification:
| Model | XCEM |
| Layer | 16 |
| Brand | XCE |
| Board THK | 1.2MM |
| Surface finish | HASL Lead free |
| Size | 170*115mm |
| Copper THK | 1.5oz |
| Origin | Shenzhen |
Description:
we have accumulated abandunt experiences in the line of high frequency microwave business for
which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,
4G antena so on and so forth.our company's sufficient stocks of hi-frequency pcb materials such as
Rogers,
TACONIC,Arlon,Isola,F4B,TP2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies
like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers
with high quality.furthermore,we also keen on helping customers shorten the period of production
development and 24 hours of sample service is available.
Parameter:
|
No. of Layer |
Up to 40 layers |
|
|
Material |
FR-4 (Tg≤210, Halogen Free, High Frequency), FR-4 High Tg |
|
|
RCC, BT, PEFE, TEFLON, TACONIC, ARLON, High Frequency Rogers |
||
| CEM-1, CEM-3, 22F, Metal Base/Ceramic Base/Aluminum Base | ||
|
Min. Width/Spacing |
50um/50um |
|
|
Copper Thickness |
1/3~12oz (12~420um) |
|
|
Thickness |
0.1~6.0mm (0.004’’~0.240’’) |
|
|
Min. Hole Spacing |
PTH (Plated Through Hole) |
0.10mm (0.004’’) |
|
NPTH (Non Plated Through Hole) |
0.10mm (0.004’’) |
|
|
Surface Finish |
HASL, HASL Lead Free, OSP, ENIG, Immersion Tin, Immersion Silver |
|
|
Nickel Plating, Flash Gold, Gold-Finger, Carbon, Sliver Grout, ENIG, Electroplated soft gold, Electroplated Hard Gold. |
||
|
Special Processing Board |
Copper plate edge, Sink hole, Tear ink, FPC |
|
Why choose us:
15 years experience in PCB manufacturing
ISO9001, TS16949, UL Approval and RoHS compliant
One stop solution for PCB design, quick-turn prototyping, components sourcing, SMT & Through-hole assembly, Functional testing, Enclosure assembly.
Full Range of Testing Services: Visual and AOI Inspection, In Circuit Testing, X-Ray for BGA and Functional Testing.
Small to medium volume to production level quantities.
NDA (NON-DISCLOSURE AGREEMENT) is provided to sign for the confidentiality of your design
