Microwave / RF / Antenna PCB HF Printed Circuit Boards Solution Provider
Description:
Material: Taconic high frequency
layer count: 1-26L
Board thickness: 0.2-3.2mm
Finishing copper thickness: 0.5-4oz
Solder mask:green
Silkscreen:white
Surface Finish: OSP
Flying probe testing: 100%pass
Minimum hole size: 0.2mm
Minimum track width/space: 0.25/0.25mm
Certificates: UL,SGS,ISO9001:2008
Advantage:
- Blind and/or buried vias
- Via-in-pad
- Through vias from surface to surface
- 20 um circuit geometries
- 30 um dielectric layers
- 50 um laser vias
- 125 um bump pitch processing
FR4 (Tg – 135C, 145C, 170C)
Rogers Ultralam 2000
Rogers RO4350
Rogers RO4003
Polyimide
Teflon
Black FR4
Getek Copper
Clad Thermal Substrates
Hybrid (Rogers and FR4)
BT Epoxy
Nelco 4013
HASL – Leaded Solder Tin/Nickel
HASL – Lead Free Solder
Electroless Soft Gold
Wire Bondable Soft Gold
Nickel Flash Gold
Electroless Nickel
Immersion Gold OSP
Electrolytic Nickel /Hard Gold and Selective Gold
Immersion Silver
Immersion Tin
Carbon Ink
ENIG
Layer: 1 to 36 layers
Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness: 0.21mm to 3.4mm
Copper thickness: 0.5 OZ to 4 OZ
Copper thickness in hole: >25.0 um (>1mil)
Size:
- Max. Board Size: (580mm×1200mm)
- Min. Drilled Hole Size: 4mil(0.1mm)
- Min. Line Width: 3mil (0.075mm)
- Min. Line Spacing: 3mil (0.075mm)
Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Solder Mask Color: Green/Yellow/Black/White/Red/Blue
