100% E-testing PCB Assembly OEM & ODM PCBA Service For Hi-tech Electronics Products
Quick detail:
- Model:XCEA
- Solder mask:Green,white silk screen
- Size:9*9cm
- Location:Shenzhen
- Application:
- Industrial control
- Alarm products
- Measurement device
- Telecom audio and video
- Electronic security health and medical
- LED application test instrument
- Consumer electronics
Parameter
|
Quantity |
Prototype&Low Volume PCB Assembly,from 1 Board to 250,is specialty,or up to 1000 |
|
Type of Assembly |
SMT,Thru-hole |
|
Solder Type |
Water Soluble Solder Paste,Leaded and Lead-Free |
|
Components |
Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement |
|
Bare Board Size |
Smallest:0.25*0.25 inches Largest:20*20 inches |
|
File Formate |
Bill of Materials Gerber files Pick-N-Place file |
|
Types of Service |
Turn-key,partial turn-key or consignment |
|
Component packaging |
Cut Tape,Tube,Reels,Loose Parts |
|
Turn Time |
Same day service to 15 days service |
|
Testing |
Flying Probe Test,X-ray Inspection AOI Test |
|
PCB assembly process |
Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing |
Advantage:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
