Computer Circuit Board Multilayer PCB Design Prototype Service
Specification:
| Model | XCEM | Origin | Shenzhen |
| Min line space | 10mil | Min line width | 10mil |
| Size | 18*9cm | Copper foil | 35UM |
| Layer | 6 | Material | FR4 |
Service:
custom printed circuit boards
custom pcb
High Powe PCB
recycling printed circuit boards
copper printed circuit board
double sided printed circuit boards
rapid prototyping circuit boards
copper printed circuit board
HF PCB
Professional , high performance pcb
Parameter:
|
Technology |
Capabilities |
Capabilities |
|
Max.Layer Count |
30 Layers |
30 Layers |
|
Max.Panel Size |
27.5"x24" |
27.5"x24" |
|
Max.Board Thickness |
3.5mm |
5.8mm |
|
Outer Layer |
3.5/3.5mils |
3/3mils |
|
Inner Layer |
3.5/3.5mils |
3/3mils |
|
Min.Board Thickness |
2L:6mils |
2L:6mils |
|
|
4L:15mils |
4L:15mils |
|
|
6L:23mils |
6L:23mils |
|
Min.SMT/BGA Pitch |
12mils for SMT |
12mils for SMT |
|
|
24mils for BGA |
20mils for BGA |
|
Min.Drill Size&Aspect Ratio |
0.2mm Drill for 0.8mm Thickness(4.0:1) |
0.2mm Drill for 0.8mm |
|
|
0.25mm Drill for 1.6mm |
0.25mm Drill for 1.6mm |
|
|
0.30mm Drill for 2.4mm |
0.30mm Drill for 2.4mm |
|
Surface Finishes |
HASL |
HASL |
|
|
Selective Immersion Tin |
Selective Immersion Tin |
|
|
Immersion Silver |
Immersion Silver |
|
|
Immersion Gold |
Immersion Gold |
|
|
Hard Gold |
Hard Gold |
|
|
OSP |
OSP |
|
|
Gold finger |
Gold finger |
|
Controlled Impedance |
+/- 10% |
+/-7% |
|
Contouring |
Routing, V-Groove, |
Routing, V-Groove, |
|
|
Beveling Punch |
Beveling Punch |
|
Hole Diameter |
+/- 2 mil |
+/- 2 mil |
|
Min.S/M Thickness |
0.4 mil |
0.6 mil |
Our Quality:
We are committed to providing the HIGHEST QUALITY PCBs that not only meet but exceed our customers’ expectations and requirements. Our facilities hold a list of quality certifications (IS9001, TS16949, UL) and the systems to support them. For quality control purposes, we have invested extensively in inspection machinery, including:
High-voltage E-test
Flying probe machine
Digital computer metallographic microscope
Copper thickness tester
Solderability detecting machine
Photoelectricity balance
X-ray gold thickness tester
Backlighting tester
Automatic optical inspector
