Kovar Alloy - Strip of Sealing Alloy 4J29 for Integrated Circuit Framework

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Kovar Alloy - Strip of Sealing Alloy 4J29 for Integrated Circuit Framework

 

Application: Vacuum device main seal structure material

Feature: At 20 to 450 degrees and having a linear expansion coefficient similar borosilicate hard glass, high Curie point, has good low temperature stability of the organization. Suitable for use in mercury discharge instrument. Rectangular hysteresis loop.

 

Specifications

Grade

4J29- Strip

Thickness

0.01~5mm

Width

4~250mm

Weight of coil

2-50 kgs

Condition

Soft/ Hard; Bright/ Oxidized

 

 

Chemical composition(%)

 

Grade

C

Si

Mn

P

S

Ni

Cu

Cr

Mo

Co

Fe

4J29

≤0.03

≤ 0.3

≤ 0.5

≤0.02

≤0.02

28.5~29.5

≤ 0.2

≤0.2

≤0.2

16.8~17.8

Bal.

 

Physical properties

  • Density (g/cm3): 8.17
  • Elastic Modulus (MPa): 165*103
  • Mean Coefficient of Thermal Expansion (10-6/): 5.0 (20~400); 5.2 (20~450)
  • Curie point (): 430
  • Electrical resistivity (μΩ*cm): 46 (20)
  • Specific heat (J/kg*): 418
  • Thermal conductivity ( W/m. ): 20.3

 

Mechanical properties

 

 

Yield Strength (Mpa)

Tensile Strength (Mpa)

Elongation, %

Hardness, HV

4J29

Cold-rolling

695

780

5

230

As annealed

315

520

24

148

 

 

 

 

 

 

 


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Mr. Martin Lee
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Shanghai Tankii Alloy Material Co.,Ltd,
Buliding 6, No 388, Pangu Road, Shanghai, China (Mainland)
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