Flex, rigid flex, and rigid PCB form factors SMT, through-hole, and mixed technology Board sizes up to 18" x 14" Complex, high density assemblies PBGA, CBGA, TBGA, FPGA, CGA, LGA Package on Package (PoP) assembly Micro BGA (0.4mm) 0402s, 0201s, 01005s Wave and selective solde http://www.hemeixinpcb.com |
PCB Assembly PCB Assembly
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