One Side Shiny RA Copper Foil For Flexible Copper Clad Laminate Based FPC
Applications:
- Flexible Copper Clad Laminate(FCCL) ;
- Fine Circuit Flexible Printed Circuit Board ;
- LED coated crystal thin film ;
- HDI dry or wet film before treatedment ;
- The solder green oil before treatment .
Advantage:
- Copper surface are can be increased and can improe the fry or wet green oil film 's adhesion with copper foil ;
- Also it can supports the Anti-peeling of the solder oil when making HDI board by the mathod of chemical shen tin, chemical nickel gold etc.
Dimension Range:
- Copper Foil thickness from 12~100µm can be supplied for FPC.
- Width can be made according to clients’ requirement up to 600mm.
Performances:
- Strong antioxidant properties
- Good mechanical properties
- High flexibility and extensibility
- Even and smooth surface
- Good fatigue resistance
Features:
The material has higher extensibility, and has a high bending resistance and no crack.
|
Item |
Unit |
Parameters |
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|
12μm |
18μm |
25μm |
35μm |
70μm |
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|
Mass per unit(±5%) |
g/m² |
105 |
160 |
300 |
400 |
445 |
|
|
Cu+Ag |
% |
≥99.99 |
|||||
|
Temper |
|
H |
O,H |
O,H |
O,H |
O,H |
|
|
Surface roughness |
Ra |
μm |
0.13 |
0.12 |
0.1 |
0.08 |
0.08 |
|
Rz |
μm |
1.3 |
1.0 |
0.8 |
0.74 |
0.76 |
|
|
|
High Temp /220 |
N/mm² |
≥140 |
≥150 |
≥170 |
≥210 |
≥220 |
|
Elongation |
Normal Temp /23 |
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