Double Shiny HP RA Cu Foil For PCB With Maximum Width 600mm In Roll
High-precision Rolled Copper Foil
Rolled Copper Foil has extraordinary strength, bendability, ductility and lustrous surface, plus its excellent
mechanical capacity, makes it irreplaceable as a raw material.
Base Material: C11000 Copper, Cu > 99.96%
Thickness Range: 0.0002inch~0.004inch (0.006mm~0.10mm)
Width Range: 0.04inch~25.6inch (1.0mm~650mm)
Temper: Hard, Quarter Hard, Half Hard, Soft
Application: CCL, Electronics shielding and heat radiation, wide copper tape etc.
|
Name |
GB |
ALLOY NO. |
SIZE (mm) |
||||
|
(ISO) |
(ASMT) |
(JIS) |
(BIS) |
(DIN) |
|||
|
Copper Foil |
T2 |
Cu-ETP |
C11000 |
C1100 |
C101 |
R-Cu57 |
Thickness: 0.006-0.1 /Max Width: 650 |
Mechanical Properties
|
Temper |
JIS Temper |
Tensile Strength Rm/N/mm 2 |
Elongation A50/% |
Hardness HV |
|
M |
O |
310~410 |
≥ 30 |
40~60 |
|
Y2 |
1/2H |
320~450 |
≥ 20 |
55~85 |
|
Y |
H |
440~480 |
- |
80~150 |
|
T |
EH |
450~540 |
- |
- |
Note: We can provide products with other properties according to customers` requirements.
Physical Properties
Density: 8.9g/cm3
Electrical conductivity (20°C): min 90%IACS for annealed to temper
min 80%IACS for rolled to temper
Thermal conductivity (20°C): 390W/(m°C)
Elastic modulus: 118000N/m
Softening temperature: ≥380°C
Sizes and Tolerances (mm)
|
Thickness |
Thickness Tolerances |
Width |
Width Tolerances |
|
0.006~0.04 |
± 0.001 |
1.0~650 |
± 0.1 |
|
> 0.04~0.10 |
± 0.002 |
Specifications Available (mm)
|
Thickness |
Width |
Temper |
|
0.006~0.04 |
1.0650 |
O,1/2H,H,EH |
|
> 0.04~0.10 |
1.0650 |
O,1/2H,H,EH |
Carried Standard(Latest)
|
Nations |
Standard No. |
Standard Name |
|
China |
GB/T2059--2000 |
CHINA’S NATIONAL STANDARD |
|
Japan |
JIS H3100 :2000 |
COPPER AND COPPER ALLOY SHEETS,PLATES AND STRIPS |
|
U.S.A |
ASTM B36/B 36M -01 |
STANDARD SPECIFICATION FOR BRASS,PLATE,SHEET,STRIP AND ROLLED BAR |
|
Germany |
DIN-EN 1652:1997 |
COPPER AND COPPER ALLOYS PLATE,SHEET,STRIP AND CIRCLES FOR GENERAL PURPOSES |
|
DIN-EN 1758 :1997 |
COPPER AND COPPER ALLOYS STRIP FOR LEADFRAMES |
|
|
SEMI |
SEMI G4-0302 |
SPECIFICATION FOR INTERGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES |
Application
Why Choose us Civen as your supplier?
1. Very competitive price
2. Small order acceptable
3. Good quality
4. On time delivery and perfect service
5. Customers' design are welcome!
