550mm - 1295mm Width Electrolytic Copper Foil for Printed Circuit Board

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550mm-1295mm Width ED Copper Foil for Printed Circuit Board with Different Thickness

 

 

Characteristics & Performance:

 

1. HTE, LP or VLP

2. Power Peeling Level: ≤II

3. Width Deviation: by roll~(+2.0,0)  by sheets~(+2.0,-2.0)

4. Area Weight: fits the IPC-4562 3.3 protocol

5. Warranty: 180 days after delivery

6. Storage Conditions: neat and dry, no corruption chemical or wet things nearby.

    Relative Humidity  65%, Temperature:  25°C

7. Packing: Wrapped by thin plastic film and loaded in wooden boxes, then fixed by packing belt.

    A label with be pasted outside, showing product name, nw, gw, Rohs tag and manufacturer. 

 

Description:

 

1. We provide 1/3 oz/ft² to 2oz/ft² (normal thickness 12um~70um) high temperature elongation (HTE) ED copper foils with width from 550~1295mm.

2. Quality reaches the II and III requirements of the international  standard IPC-4562.

3. These products have the perfect normal temperture storage performance, the high temperature anti-oxidazation performance and high temperature elongation performance.

4. It can also be used in the production of different double-face and multi-layer printed circuit boards.

5. We can also provide low-profile (LV) and very-low-profile (VLP) HTE ED copper foils.

 

Application

 


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Mr. Duearwin Moon
Tel: 86-21-56351345
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Civen Metal Material Co.,Ltd
Office: Room No. 1#B107, No.666 Xincun Road, Shanghai, China (Mainland)
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