Immersion Gold Multilayer Circuit Board PCB Plated Through Hole Tg 170 Blind Via
Product Parameter
| PCB SIZE | 230 x 209mm=48PCS |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 4 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 17.8um(0.5oz)+plate TOP layer |
| Prepreg 7628 0.195mm | |
| copper ------- 18um(0.5oz) MidLayer 1 | |
| FR-4 1.0mm | |
| copper ------- 18um(0.5oz) MidLayer 2 | |
| Prepreg 7628 0.195mm | |
| copper ------- 17.8um(0.5oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 6.7mil/5.9mil |
| Minmum / Maximum Holes: | 0.3/2.5mm |
| Number of Different Holes: | 13 |
| Number of Drill Holes: | 2512 |
| Number of Milled Slots: | 144 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-180 TG>170, er<5.4 |
| Final foil external: | 1oz |
| Final foil internal: | 0.5oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold (31.3%) 2 micoinch over 100 microinch nickle |
| Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented. Blind via from to inner layer 1 |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | Voip system, Gps Tracker For Car Step Up Transformer USB Wireless 12 Volt Battery Charger Wireless Speaker System |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
a) 94V0 flame retardant fiber.
b) High Tg material reliable.
c) Excellent solderability on gold flat surface
d) No minimum quantity required for buyers.
More Applications in electronics
Wlan Antenna
Car Inverters
Solar Power Inverters
Remote I/O
Interface Module
PCB knowledge: The Difficulty Factors for Multilayer boards
Multilayer PCB’s represent one of the most complicates products in PCB industry. In order to design producible multilayer PCB’s, it is imperative that PCB designers understand the processes and difficulty factors
*Build-up
The more layers in a multilayer PCB’s, the greater risk of mis-registration during laminate process. The difficulty factor, therefore, increase with an increasing layer counts.
*Core thickness of rigid inner laminates
Inner layers are normally based on thin rigid laminate cores with copper cladding. The thinner the rigid laminates, the more difficult they are to handle, for example, in the etching process.
*Thickness tolerance (total thickness inclusive of copper foils)
The difficulty factor and the rejection rate depend very much upon the thickness tolerance required, and indirectly upon the layer build-up. When thickness tolerance T=±10%, obviously rejection ratio trends to zero.
FAQ: Do you sell rigid-flex PCB?
Sorry. We currently do not offer rigid-flex PCB.
