Four Layer Tg135 Blind Via PCB Immersion Gold Satellite Antenna Circuit Board
PCB data sheets
| PCB SIZE | 116 x 71mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 4 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz)+plate TOP layer |
| Prepreg 7628 0.195mm | |
| copper ------- 35um(1oz) MidLayer 1 | |
| FR-4 1.0mm | |
| copper ------- 35um(1oz) MidLayer 2 | |
| Prepreg 7628 0.195mm | |
| copper ------- 35um(1oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 7mil/7.5mil |
| Minmum / Maximum Holes: | 0.6/3.5mm |
| Number of Different Holes: | 15 |
| Number of Drill Holes: | 1154 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | NO |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-140, TG>135, er<5.4 |
| Final foil external: | 1.5oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Electroless Nickle over Immersion Gold (ENIG)( 2 µ" over 100 µ" nickle) |
| Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Green, PSR-2000GT600D, Taiyo supplied. Peelabel mask. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented. Blind via from Inner layer 2 to Bottom side. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | Satellite antenna |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
a) FR-4 sustrate. It’s suitable for handheld and consumer applications. It’s also Lead free compatible.
b) Immersion gold. Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering
c) Meeting your printed circuit board needs from PCB prototyping to mass volume production.
d) No minimum order quantity. 1-10 pieces are offered for sale.
More Applications in Electronics
Broadband Router
GSM Gateway
USB GPS
Wireless Transmitter
Wireless Alarm
Electronic Lock
Electronic Cash Register
Ir Module
Audio Interface
Climate Controller
PCB knowledge: Layer Stackup
The purpose of stackup is to interleave the thin laminates and the prepreg sheets in correct sequence and ensure correct layer-to-layer registration. The stackup of multilayer boards can be done in many different ways.
Among multilayer PCB's, 12- layer is the largest number of layers that can be produced easily in 1.6mm thick.
Hybrid PCB stack up
4 layer PCB, RO4350B combined with FR-4 Core.
Genuine RO4350B 4 layer PCB vs FR-4 4 layer PCB
Build-up of FR-4 PCB (4 layer) Build-up of RO4350B PCB (4 layer)
Copper track --- Layer 1 Copper track --- Layer 1
Prepreg(PP) RO4350B Core
Copper track --- Layer 2 Copper track --- Layer 2
FR-4 Core Rogers Prepreg(PP)
Copper track --- Layer 3 &nbs
