14 Layer BGA Circuit Board Assembly 2.0mm Thick For Industrial Communication
PCB properties
| PCB SIZE | 215 x 152mm=1PCS=1design |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 14 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- TOP 17um(1oz)+plate 25um |
| 65 um prepreg 1080 x 1 | |
| copper ------- L02 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L03 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L04 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L05 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L06 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L07 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L08 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L09 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L10 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L11 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L12 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L13 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- BOT 17um(0.5oz)+plate 25um | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4.5mil/5mil |
| Minmum / Maximum Holes: | 0.4/2.0mm |
| Number of Different Holes: | 15 |
| Number of Drill Holes: | 3210 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | NO |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, IT-140, Tg >135, er<5.4 |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 2.0mm ±10% |
| PLATING AND COATING | |
| Surface Finish | Electroless Nickle over Immersion Gold (ENIG)( 0.05µm over 3µm nickle) |
| Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Green, PSR-2000GT600D, Taiyo supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented. Via in pad under BGA package |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | Industrial communication |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
a) Engineering design prevents problems from occurring in pre production.
b) Products and Manufacturing are certified by authorized organizations.
c) 100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.
d) Eligible products rate of first production: >95%
e) Devlivery on time: >98%
f) Customer complaint rate: <1%
More Applications in Electronics
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Design for Manufacture (2)
| Serial NO. | Procedure | Item | Manufacturing capability | ||
| Large volume (S<100 m²) | Middle volume (S<10 m²) | Prototype(S<1m²) | |||
| 14 | Laminating | Tolerance of laminate thickness | ±10% PCB thick | ±10% PCB thick | ±8% PCB thick |
| 15 | Maximum laminate thickness | 4.0mm |
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