Network Gateway Four Layer PCB High Temperature Circuit Board Design
PCB data sheets
| PCB SIZE | 280 x 152mm=4PCS |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 4 layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
| Prepreg 0.203mm (8mil) | |
| copper ------- 18um(0.5oz) MidLayer 1 | |
| FR-4 0.99 mm (39 mil) | |
| copper ------- 18um(0.5oz) MidLayer 2 | |
| Prepreg 0.203mm (8mil) | |
| copper ------- 18um(0.5oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4mil/4mil |
| Minmum / Maximum Holes: | 0.4 / 4.3mm |
| Number of Different Holes: | 17 |
| Number of Drill Holes: | 521 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4 TG170, CTI 175V-249V, er<5.4. ITEQ Supplied |
| Final foil external: | 1oz |
| Final foil internal: | 0.5oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold 0.05µm over 3µm Nickel (13.2% area) |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Matt Blue, SKM-S6189BLM1, KUANGSHUN supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), via tented. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | Network gateway |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
a) High Tg 170 substrate and Prepreg. Immersion gold PCB.
b) ISO certified PCB manufacturing factory.
c) Engineering design prevents problems from occurring in pre production.
d) Delivery on time. We keep higher than 95% on-time-delivery rate.
e) DDU Door to door shipment with competitive shipping cost. You don’t need to arrange anything after confirming the order. Just wait for your PCB delivery to your hand.
More Applications in Electronics
3G Wifi Modem
AC/AC Adapter
Wireless USB Dongle
Inverters
Modem Usb 4G
Performance parameter of Aluminum, Copper, Iron and Ceremic
| Material | Model | Hardness HB500KgF | Density (g/cm3) | Coefficient of thermal conductivity | Expansion coefficient(10E-6/K) |
| Aluminum | 1100 | 32 | 2.71 | 218 | 23 |
| Aluminum | 5052 | 68 | 2.68 | 138 | 23 |
| Aluminum | 6061 | 95 | 2.7 | 155 | 23 |
| Red copper | C1100 | 30 | 8.9 | 401 | 16.7 |
| Iron | D3004 | 140 | 7.8 | 80 | 1.2 |
| Ceramic | 96% AL2O3 | - | 3.8 | 20-30 | 6 |
Reference drill table and contour fabricating drawing
FAQ
What's your minimum track and spacing?
Actually this depends on the copper weight.
For half oz(18um) copper, it's 3mil / 3.5mil for prototypes, 4mil / 4mil for small production and larger at 5mil / 5mil for mass production.
For 1oz (35um) copper, it's 3mil / 4mil for prototypes, 4mil / 4mil for small production and 5mil / 5mil for mass production.
For 2oz (70um) copper, it's 6mil / 7mil for prototypes, 6mil / 8mil for small production and 7mil / 9mil for mass production.
For 3oz (105um) copper, it's 8mil / 9mil for prototypes, 8mil / 10mil for small production and 9mil /11mil for mass production.
For 4oz (140um) copper, it's 12mil / 11mil for prototypes, 12mil / 12mil for small production and 13mil / 13mil for mass production.
