FR4 10 Layer Via In Pads PCB Circuit Boards 1.6mm With Green Mask

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FR4 10 Layer Via In Pads PCB Circuit Boards 1.6mm With Green Mask

 

PCB parameters

PCB SIZE 99.1 x 105.3mm=1PCS
BOARD TYPE
Number of Layers Multilayer PCB, 10 Layer PCB
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 17.5um(0.5oz)+plate TOP Signal
4mil prepreg
copper ------- 18um(0.5oz) GND Plane
5mil FR-4
copper ------- 18um(0.5oz) SIG1
5mil prepreg
copper ------- 18um(0.5oz) SIG2
5mil FR-4
copper ------- 18um(0.5oz) PWR Plane
13mil prepreg
copper ------- 18um(0.5oz) GND Plane
5mil FR-4
copper ------- 18um(0.5oz) SIG3
5mil prepreg
copper ------- 35um(1oz) SIG4
5mil FR-4
copper ------- 35um(1oz) GND Plane
4mil prepreg
copper ------- 17.5um(0.5oz)+plate BOT Signal
TECHNOLOGY
Minimum Trace and Space: 4mil/4mil
Minmum / Maximum Holes: 0.3/5.5mm
Number of Different Holes: 31
Number of Drill Holes: 1532
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control Differential pairs impedance control and Single trace impedance control
BOARD MATERIAL
Glass Epoxy: FR-4, ITEQ IT-180 TG>170, er<5.4
Final foil external: 1oz
Final foil internal: 0.5oz
Final height of PCB: 1.6mm ±0.16
PLATING AND COATING
Surface Finish Immersion Gold (12.8%) 2µ" over 100µ" nickel
Solder Mask Apply To: Top and Bottom, 12micon Minimum.
Solder Mask Color: Green, PSR-2000GT600D, Taiyo supplied
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH), Via in Pad and via tented and not be visible.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
APPLICATION: Satellite Phone
 
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

Advantages

a) FR-4 Tg170. UL94V0 flame retardant. Excellent thermal reliability and CAF resistance providing long-term reliability for industrial and automobile application.
b) Immersion gold PCB. High solderability, no stressing of circuit boards and less contamination of PCB surface.

c) 100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.

d) ISO certified PCB manufacturing factory.

e) Meeting your printed circuit board needs from PCB prototyping to mass volume production.

 

 

More Applications in Electronics

Microprocessor
Preamplifier
Microcontroller
Multiplexer
Satellite Receiver

 

 

ITEQ Laminate/ Prepreg : IT-180ATC / IT-180ABS

IPC-4101C Spec / 99 / 101 / 126
LAMINATE( IT-180ATC)
Property Thickness<0.50 mm Thickness0.50 mm Units Test Method
[0.0197 in] [0.0197 in]
Typical Value Spec Typical Value Spec Metric IPC-TM-650
(English) (or as noted)
Peel Strength, minimum N/mm 2.4.8
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] (lb/inch)
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Mr. Mr. Kevin Liao
Tel: 86-755-27374946
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BICHENG ENTERPRISE LIMITED
3 203 Shidai Jingyuan Fuyong Town,undefined,undefined, Shenzhen, Guangdong, China (Mainland)
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