iPhone 7 7P BGA Reballing Stencil dedicate kit, iphone7 7P A10 lower Baseband CPU heating Reball Tool, Ball Soldering Net Stainless Steel Plate for iphone 7 7 plus A10 lower Baseband CPU WIF.
iPhone 7 7P A10 lower Baseband CPU WIFI tin plate steel
[ Optional ]:
Optional 1: K01 A10 CPU
Optional 2: K02 Baseband CPU
Optional 3: K03 WIFI
Optional 4: K04 Big Power IC
Optional 5: K06 Small Power IC