1. 8 layers impedance PCB with red soldermask
Minimum line width/space: 4mils
Surface finish: immersion gold
Board thickness: 1.60MM
Minimum drilled hole diameter: 8mils
Copper thickness: 1oz
Special process : 0.45MM BGA , red soldermask
2. 8 layers PCB with BGA and golden fingers
Minimum line width/space: 4mils
Surface finish: immersion gold
Board thickness: 1.20MM
Minimum drilled hole diameter: 8mils
Copper thickness: 0.5oz
Special process : 0.40MM BGA , golden fingers
3. 4 layers pcb with 5 BGA
Minimum line width/space: 6mils
Surface finish: immersion gold
Board thickness: 1.00MM
Minimum drilled hole diameter: 8mils
Copper thickness: 1oz
Min BGA size : 0.40MM
4. 6 layers rigid-flexible PCB
Board thickness: 0.60MM
Copper thickness: 0.5oz
Minimum line width/space: 3/3mils
Minimum drilled hole diameter: 0.10MM
Surface finish: ENIG
Special process : mix lamination ,laser drilling
.jpg)
