Condensation cure electronic Potting Silicone for PCB
Characteristics:
HY210 and HY215 are condensation silicone potting compound in two parts with yhe characteristics of low ciscosity easy pouring operation and good bonding feature. It can be cured completely at room temprature . The safty of potting compound silicone can reach the EU-ROHS requires fully.
Application:
Applying for the surface of PC (Poly-cabonate) PP ABS PVC metal etc
Potting for Protection of general electronics parts
Insulation waterproof and bonding of electronic display circuit board
Outdoor protectiom for LED screen.
Technical Parameters for Condensation cure electronic Potting Silicone for PCB
Properties index | Part A | Part B | |
Before Curing | Appearence | Black fluid | Colorless / yellowish fluid |
Viscosisty (cps) | 2500±500 | - | |
Features when operation | Mixing Ratio ( By weight) | 10:1 | |
Operating Time (25C /min) | 20~30 | ||
Curing time ( hr, basically cured) | 3 | ||
Curing time ( hr, perfectly cured) | 24 | ||
Hardness(shore A) | 15+/-3 | ||
After Curing | Thermal Conductivity[W( m·K)] | ≥0.4 | |
Dielectric Strength( kV/mm) | ≥25 | ||
Dielectric permittivity(1.2MHz) | 3.0~3.3 | ||
Volume resistivity(Ω·cm) | ≥1.0×1016 | ||
Fire Resistance | 94-V1 | ||
(Pls note all data of PCB Electronic Potting Silicone Rubber with black color above is in 25C with 55% humidity conditions. We don't guarantee a same date if testing under different conditions or when data was regenerated).
Warm Tips for for PCB Electronic Potting Silicone
1. Sealing pakage for storage. The mixture should be used up at once to avoid wasting.
2. Silicone belongs to non-dangerous goods but keep away form mouth and eyes.
3. When it gets stratified after a period of storage Please mix HY-210# evenly before using it does not affect the performance.
Package for for PCB Electronic Potting Silicone
20kg/drum 25kg/drum 200kg/drum
Shelf Life and Transportation
1. Twelve(12) months when stored at 25C in original unopened packages.
2. This is a non-dangerous product it can be transported as general chemicals.
3. Products exceed the storage life should be confirmed normal before using.
Technical Guidelines
1. Pls put part A and B in separate container and stir evenly before mixing the two
parts together.
2. Mixing Ratio part A:part B is 10:1
3. Bubble release if necessary deaeration the mixture under 0.08 MPa for 3 minutes.
4. HY-215# is cured at roon temperature so pls put it under room temperature after
pouring. It comes to next process when basically cured and it takes about 24 hours
for completely cured.
Further information for Condensation cure electronic Potting Silicone for PCB, please feel free to contact Ms Alice :
Skype: silicone hy
QQ: 2355542574
