PCBA capacity
Item | Specification | |
1 | Type of Assembly | SMT Assembly (Surface-mounting technology) |
Thru-hole Assembly (Through-hole soldering Technology) | ||
2 | Solder Type | Water soluble solder paste, lead free |
3 | Component | Component sourcing service |
4 | Min. IC Pitch | 0.30mm |
5 | Foot Pin | SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA |
6 | Min. Chip Placement | 1005 |
7 | Max. PCB Size | 600mm*400mm |
8 | Min. PCB Thickness | 0.35mm |
9 | Max. BGA Size | 74mm*74mm |
10 | Max. Ball Pitch | 1mm-3mm |
11 | Max. Ball Diameter | 0.4mm-1mm |
12 | QFP Lead Pitch | 0.38mm-2.54mm |
13 | Package | Inner package: anti-static bubble Bag |
Outer Package: carton box | ||
14 | Certificate | PCB Assembly with UL, RoHS approval |
