Transparent immersion silver medical equipment fpcb/electronic flexible pcb circuit board
About us:
Hitech focuses on high-mix, low volume and quick turn pcb service. With a special market position and excellent corporate culture, we can provide "One-stop shop" service from 1 to 26 layers of PCB products, which includs double layers PCB, Multilayer PCB, Aluminium PCB (Metal core PCB) Flexible PCB (FPCB), Rigid-Flex PCB (Flex-rigid PCB), High Density Interconnect (HDI )PCB boards, heavy copper boards, buried Capacitance & resistance boards, etc. Our products cover various products are exported to Europe, America and Asia.
Our Superiority is the Professionalism of our team
- PCB And PCB Assembly For One-stop Service with Original Components According the BOM.
IC Imported from Digikey / Farnell etc.
- Low Cost with High Quality, Commitment of Quality Assurance.
- For 10 years Experience in PCB Field. ( Our Factory owns advanced
production equipment and experienced technical personnel. )
Detailed specification of manufaturing capacity:
| NO | Item | Craft Capacity |
| 1 | Layer | 1-30 Layers |
| 2 | Base Material for PCB | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material |
| 3 | Rang of finish baords Thickness | 0.21-7.0mm |
| 4 | Max size of finish board | 900MM*900MM |
| 5 | Minimum Linewidth | 3mil (0.075mm) |
| 6 | Minimum Line space | 3mil (0.075mm) |
| 7 | Min space between pad to pad | 3mil (0.075mm) |
| 8 | Minimum hole diameter | 0.10 mm |
| 9 | Min bonding pad diameter | 10mil |
| 10 | Max proportion of drilling hole and board thickness | 1:12.5 |
| 11 | Minimum linewidth of Idents | 4mil |
| 12 | Min Height of Idents | 25mil |
| 13 | Finishing Treatment | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. |
| 14 | Soldermask | Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask. |
| 15 | Minimun thickness of soldermask | 10um |
| 16 | Color of silk-screen | White, Black, Yellow ect. |
| 17 | E-Testing | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
| 18 | Other test | ImpedanceTesting,Resistance Testing, Microsection etc., |
| 19 | Date file format | GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++ |
| 20 | Special technological requirement | Blind & Buried Vias and High Thickness copper |
| 21 | Thickness of Copper | 0.5-14oz (18-490um) |
Equipment List:
| NO. | Machine Name | QTY | NO. | Machine Name | QTY |
| 1 | PRESS | 2 | 10 | Exposurer | 5 |
| 2 | X-Ray | 1 | 11 | Deveoloper | 3 |
| 3 | Brown-Oxidation | 1 | 12 | Auto V-cut | 1 |
| 4 | Drilling | 13 | 13 | AOI | 2 |
| 5 | Cutter | 1 | 14 | Routing | 7 |
| 6 | PTH | 1 | 15 | ETS | 12 |
| 7 | PAL | 1 | 16 | Fly Probe | 4 |
| 8 | PAT | 1 | 17 | YAMAHA SMT | 3 |
| 9 | Flash Gold | 1 | 18 | FUJI SMT | 4 |
Packaging Details
1.Firstly seal products with hermetic plastic bag vrey well
2.Then using bubble or foam sheet to seperate them
3.Finally paper carton packing
