product details
(1)purity:99.95%
Conventional size:300mesh,400 mesh,1-3µm 3-5µm
(2)application:suitable for low silver content low temperature curing electronic paste, such as: conductive adhesive, shielding silver paste, etc..
(3) chemical composition
Chemical composition and physical indexes | |||||||||
purity | The following components are not greater than(%) | physical indexes | |||||||
Ag | Pt | Pd | Au | Rh | Lr | Cu | Ni | Loose density | Particle size distribution |
99.95% | 0.002% | 0.002% | 0.002% | 0.001% | 0.001% | 0.01% | 0.005% | 1.6 -2.4 g/cm3
| D10: 3.0 -5.0 μｍ D50:6.0 -10.0 μｍ D90:12.0 -20.0 μｍ |
Fe | Pb | Al | Sb | Bi | total impurities | ||||
0.01% | 0.001% | 0.005% | 0.001% | 0.002 | 0.05% | ||||
Conventional size:300mesh,400 mesh,1-3µm 3-5µm | |||||||||
