BERGQUIST SIL PAD TSP 1600S Formerly known as SIL PAD 900S
High Performance Insulator for Low-Pressure Applications
Features and Benefits
• Thermal impedance: 0.61°C-in. 2 /W
(at 50 psi)
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface
material solution
The true workhorse of the SIL PAD product family, BERGQUIST SIL PAD TSP 1600S thermally conductive
insulation material is designed for a wide variety of applications requiring high thermal performance and electrical
isolation. These applications also typically have low mounting pressures for component clamping.
BERGQUIST SIL PAD TSP 1600S material combines a smooth and highly compliant surface characteristic with high thermal
conductivity. These features optimize the thermal resistance properties at low pressures.
Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and
TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of force
to the semiconductor. The smooth surface texture of BERGQUIST SIL PAD 900S minimizes interfacial thermal
resistance and maximizes thermal performance.
BERGQUIST SP900S Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
