Sliver-coated Copper powder
Application
Apply to HJT conductive silver paste, conductive inks, conductive adhesives, membrane switch and other low or medium temperature conductive pastes, which can replace silver powder.
Product Features
1. Uniform particle size
2. Good dispersion property
3. High anti-oxidation temperature
4. Good electric conductivity
Product specification
Specification | Mean Particle Size (μm) | Specific Surface Area (m2/g) | Particle Size Distribution (μm) | Ag Content (wt%) | ||
D10 | D50 | D90 | ||||
CuAg-S0501 | 0.5 | 1.50-2.50 | ≤1.00 | ≤2.00 | ≤4.00 | 15-30 |
CuAg-S1001 | 2.0 | 0.45-0.65 | ≤2.50 | ≤4.00 | ≤5.50 | 10-30 |
CuAg-S3501 | 3.5 | 0.25-0.45 | ≤3.80 | ≤6.00 | ≤9.30 | 10-30 |
CuAg-F0501 | - | 1.90-2.00 | ≤1.70 | ≤3.70 | ≤5.60 | 15-30 |
CuAg-F1001 | - | 0.80-0.95 | ≤3.20 | ≤4.80 | ≤6.30 | 10-30 |
CuAg-F3501 | 0.55-0.75 | ≤3.50 | ≤5.80 | ≤7.50 | 20-30 | |
CuAg-F5001 | - | 0.35-0.60 | ≤3.80 | ≤7.10 | ≤10.30 | 10-20 |
Different specifications products can be customized.
