Base Material:Aluminum-based PCB
Thermal conductivity:1.0W/m.k
Layer Counts:1L+Al
Board Thickness:1.0mm
Copper Thickness:1OZ
Min. Hole Size:40mil (1.0mm)
Min. Line Width/ Spacing:12mil (0.3mm)/10mil (0.25mm)
Solder mask Color: None
Silkscreen Color: None
Surface Finishing:ENIG
Min.Quantity of Order:No MOQ
Certificate:UL, ISO 9001, ISO 14001
Difficulty:Metal-substrate PCB, Thermal conductivity 1.0W/m.k