UV Laser Precision Micro Machining System

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Description :With strong technical capability and process experience, delphilaser successful developed a new generation high-end laser system. This system delivers high performace in cutting, drilling and surface treatment in glass, Ceramic, Sapphire, Silicon, Cu, Alloys and organic films with high throughput, good quality and flexibility.


Applications
Main applications in micro-drilling, cutting on glass, Ceramic, Sapphire, Silicon, Cu, Alloys and organic films, especially on hard and brittle materials such as glass, Ceramic, Sapphire, etc. 
Features :Features
1. High efficiency, high stability
2. Small thermal effect, excellent in shape
3. Suitable for a variety of graphics formats
4. High density drilling
 
Specification :Specifications: FinePioneer/QuickSweeper
Wavelength: 355nm
Pulse width: 8-15ns
Average power: 3W\6W\8W
Pulse energy stability: <3%RMS
Maximum aspect ratio: 4: 1
Minimum diameter: 70um
 

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Mr. David Kao
Tel: 86-512-87189094-8015
Mobile: 18606217115
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Contact Method
Suzhou Delphi Laser Co., Ltd
China (Mainland)
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