HJMT1-25(4000-G/TR)
1.The HJMT1-25(4000-G/TR) Splicing Module combines a HJM1-25(4000-D/TR) Super-MiniModule with gel. It delivers in place performance withstanding extended exposure to various conditions of extremely high humidity, including water immersion, while maintaining insulation resistance and circuit integrity. It is used for two-wire splicing applications.
2.The Module accepts 0.65-0.32mm(22-28 AWG) solid copper conductors with PIC, pulp or paper insulation diameters 1.65mm(0.065") in the insulation displacement contact(IDC) at both ends of the element.
3.The length is 165.0mm (6.5"). The width is 15.2mm (0.60"). The crimp Height is 9.8mm (0.39").
4.All materials is suitable for operation in the tropic with maximum temperature up to 70℃.
5.All materials used in the connectors shall be non-toxic and dermatologically safe.
6.Moudle can retain the electrical & mechanical properties in the test report
over working temperature range -30℃ to 70℃ and humidity range of 0% to 95%.
