FR4 Copper clad laminate is made of epoxy resin, high quality glass cloth and copper foil. It has excellent
heat resistance, good mechanical & electrical properties, high peel strength and chemical resistance,
Suitable for making flame resistant PCB of
high_grade electronic equipment, computers and other printed circuit boards that required high density and
excellent heat resistance.
heat resistance, good mechanical & electrical properties, high peel strength and chemical resistance,
Suitable for making flame resistant PCB of
high_grade electronic equipment, computers and other printed circuit boards that required high density and
excellent heat resistance.
Peel strength (35μm copper foil) : min 1.4 N/mm
immerse resistance288℃,20S:no change
Dielectric Voltage:≥40KV
Dielectric Constant (1MHz):≤5.4
| GeneralProperties | ||||
| TestItem | Unit | Condition | TypicalValue | |
| FR-4CCL | ||||
| Surfaceresistivity | Afterdamp | MΩ | F | ≥104 |
| Volumeresistivity | Afterdamp | MΩ.cm | F | ≥106 |
| Afterheattreatment | E-24/125 | ≥103 | ||
| DielectricVoltage | KV | D-48/50+D-0.5/23 | ≥40 | |
| DielectricConstant(1MHz) | C-40/23/50 | ≤5.4 | ||
| Peelstrength(35μmcopperfoil) | N/mm | A | ≥1.40 | |
| Immerseresistance | 288℃,20S | Nodelamination Non-foaming | ||
| 260℃,20S | -- | |||
| Bendingstrength | Vertical | MPa | A | ≥410 |
| Parel. | A | ≥340 | ||
| Waterabsorption | % | E-1/105+des+D-24/23 | 0.10-0.77≤0.80 | |
| 0.78-3.20≤0.35 | ||||
| Flammability | A&E-1/105+des | 94V-0 | ||
