Computer Cables & Connectors

1.Reduced wiring errors
2.Elimination of mechanical connectors
3.Unparalleled design flexibility
4.Higher circuit density

1.Reduced wiring errors
2.Elimination of mechanical connectors
3.Unparalleled design flexibility
4.Higher circuit density

1.Reduced wiring errors
2.Elimination of mechanical connectors
3.Unparalleled design flexibility
4.Higher circuit density

1.Reduced wiring errors
2.Elimination of mechanical connectors
3.Unparalleled design flexibility
4.Higher circuit density

1.Reduced wiring errors
2.Elimination of mechanical connectors
3.Unparalleled design flexibility
4.Higher circuit density

1.Reduced wiring errors
2.Elimination of mechanical connectors
3.Unparalleled design flexibility
4.Higher circuit density

1.Reduced wiring errors
2.Elimination of mechanical connectors
3.Unparalleled design flexibility
4.Higher circuit density

1.Reduced wiring errors
2.Elimination of mechanical connectors
3.Unparalleled design flexibility
4.Higher circuit density

1.Reduced wiring errors
2.Elimination of mechanical connectors
3.Unparalleled design flexibility
4.Higher circuit density

1.Reduced wiring errors
2.Elimination of mechanical connectors
3.Unparalleled design flexibility
4.Higher circuit density

1.Reduced wiring errors
2.Elimination of mechanical connectors
3.Unparalleled design flexibility
4.Higher circuit density

1.Reduced wiring errors
2.Elimination of mechanical connectors
3.Unparalleled design flexibility
4.Higher circuit density

1.Higher circuit density
2.More robust operating temperature range
3.Stronger signal quality
4.Improved reliability and impedance control

1.Stiffener Material:FR-4, Mylar or Kapton
2.Base Materials:Polyimide or Polyester
3.Solder-stop coating:Coverlay or flexible solder-stop

1.Stiffener Material:FR-4, Mylar or Kapton
2.Base Materials:Polyimide or Polyester
3.Solder-stop coating:Coverlay or flexible solder-stop

1.Reduced wiring errors
2.Elimination of mechanical connectors
3.Unparalleled design flexibility
4.Higher circuit density

1.Surfaces:Immersion gold (recommended), immersion tin, Lead-free HAL
2.Base Materials:Polyimide (0.025mm , 0.050mm) or Polyester (0.076mm, 0.127mm)

Toolless UTP Cat.5 Keystone modules
1.90 degree
2.TIA/EIA Cat5E requirements
3.In T568A/B wiring scheme
4.With cover,preventing dust

Toolless UTP snap-in Cat5 Keystone Jack
1.90 degree
2.TIA/EIA Cat5E requirements
3.In T568A/B wiring scheme
4.With cover,preventing dust

5921-S-K-2x8-L-8C:5921 series-shield type-front full-open window-2x8 port-led-8p8c