4layers PCB fabrication with non-halogen material and Immersion silver finishing

Price: 48.0~53.0 USD
Trade Term: FOB
Payment Terms: T/T,L/C,D/A,D/P,WU
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Basic Info.
  • Number of Layers: 6-Layer 
  • Brand Name: TWS 
  • Base Material: FR-4 
  • Copper Thickness: 1oz 
  • Board Thickness: 1.0mm 
  • Min. Hole Size: 0.2 
  • Min. Line Width: 0.076mm 
  • Min. Line Spacing: 0.076mm 
  • Surface Finishing: Immersion Silver 
  • Size: 456mm*220mm 
  • Inner Copper thickness: 0.5oz 
  • Model No.: TWS-2013073002 
  • Place of Origin: Guangdong  
  • Min.Order: 10 pcs
  • Means of Transport: Ocean, Air, Land
Supply Capacity
  • Packing:vacuum packaging and carton box

Specifications
1.UL, SGS Test, RoHS Certification, ISO9001:2008
2.1-16 layer:FR-4, Alu,
3.Short lead time
4.9 years factory experience
We can do for you:
1-16 layer FR-4 PCB board, 1-2 layer Aluminum PCB
1-6 oz copper thickness
0.2 mm hole size
0.1 mm line width/space
Our PCBs are used for wide range of electronic products,
Like Medical devices, CCTV, Power supply, GPS, UPS, Set-top Box,
Telecomunication ,LED, etc.
Factory Manufacture Capability.
Item
Manufacture Capability
Material
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based
Layer No.
1-16
Finished Board thickness
0.2 mm-3.8mm'(8 mil-150 mil)
Board Thickness Tolerance
±10%
Cooper thickness
0.5 OZ-11OZ (18 um-385 um)
Copper Plating Hole
18-40 um
Impedance Control
±10%
Warp&Twist
0.70%
Peelable
0.012"(0.3mm)-0.02'(0.5mm)
Images
Min Trace Width (a)
0.1mm (4 mil)
Min Space Width (b)
0.1mm (4 mil)
Min Annular Ring
0.1mm (4 mil)
SMD Pitch (a)
0.2 mm(8 mil)
BGA Pitch (b)
0.2 mm (8 mil)
Solder Mask
Min Solder Mask Dam (a)
0.0635 mm (2.5mil)
  
Soldermask Clearance (b)
0.1mm (4 mil)
Min SMT Pad spacing (c)
0.1mm (4 mil)
Solder Mask Thickness
0.0007"(0.018mm)
Holes
Min Hole size (CNC)
0.2 mm (8 mil)
Min Punch Hole Size
0.9 mm (35 mil)
Hole Size Tol (+/-)
PTH:±0.075mm;NPTH: ±0.05mm
Hole Position Tol
±0.075mm
Plating
HASL
2.5um
Lead free HASL
2.5um
Immersion Gold
Nickel 3-7um Au:1-5u''
OSP
0.2-0.5um
Outline
Panel Outline Tol (+/-)
CNC: ±0.125mm, Punching: ±0.15mm
Beveling
30°45°
Gold Finger angle
15° 30° 45° 60°
Certificate
ROHS, ISO9001:2008, SGS, UL certificate



View of our Plant:
4layers PCB fabrication with non-halogen material and Immersion silver finishing
4layers PCB fabrication with non-halogen material and Immersion silver finishing
4layers PCB fabrication with non-halogen material and Immersion silver finishing4layers PCB fabrication with non-halogen material and Immersion silver finishing

Our lead time:
4layers PCB fabrication with non-halogen material and Immersion silver finishing

Send message to this supplier
Ms. Grace
Tel: 86-755-29087997
Mobile: 13510820959
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Contact Method
Shenzhen Tianweisheng Electronic Co., Ltd.
4F, No. 48 Bldg., Gongle Ind. Zone, Xixiang Street, Bao' an District, Shenzhen, Guangdong, China (Mainland)
Fax: 86-755-29667579
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