Packaging & Delivery
| Packaging Detail: | Inner packing: Vacuum packing / Plastic bag Outer packing: Standard carton packing |
| Delivery Detail: | Prototype:2 days for 2L; 4 days for 4L; MP:7days |
Specifications
1. PCB Design ;
2. Certificate: UL, ISO 9001, ISO 14001 ;
3. Fast action/24hours quotation ;
4. Multilayer pcb manufacturer .
2. Certificate: UL, ISO 9001, ISO 14001 ;
3. Fast action/24hours quotation ;
4. Multilayer pcb manufacturer .
Multilayer PCB Design:
Layer: 1 to 28 layers
Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness: 0.21mm to 7.0mm
Copper thickness: 0.5 OZ to 7.0 OZ
Copper thickness in hole: >25.0 um (>1mil)
Size:
- Max. Board Size: 23 × 25 (580mm×900mm)
- Min. Drilled Hole Size: 3mil (0.075mm)
- Min. Line Width: 3mil (0.075mm)
- Min. Line Spacing: 3mil (0.075mm)
Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Solder Mask Color: Green/Yellow/Black/White/Red/Blue
Multilayer PCB Design
Why buy from us?
1. Automated equipments to reduce the cost,
2. Our prices are very competitive and quality is super
3. Fast action/24hours quotation
4. Quick prototyping and production
1. Automated equipments to reduce the cost,
2. Our prices are very competitive and quality is super
3. Fast action/24hours quotation
4. Quick prototyping and production
Our Production Capability for PCB: |
Layer | 1 to 28 layers |
Material type | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
Board thickness | 0.21mm to 7.0mm |
Copper thickness | 0.5 OZ to 7.0 OZ |
Copper thickness in hole | >25.0 um (>1mil) |
Size | - Max. Board Size: 23 × 25 (580mm×900mm) |
- Min. Drilled Hole Size: 3mil (0.075mm) | |
- Min. Line Width: 3mil (0.075mm) | |
- Min. Line Spacing: 3mil (0.075mm) | |
Surface finishing | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
Tolerance | - Shape tolerance: ±0.13 |
- Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |
Certificate | UL, ISO 9001, ISO 14001 |
Special requirements | Buried and blind vias+controlled impedance +BGA |
Profiling | Punching, Routing, V-CUT, Beveling |
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products. | |
View of our plant:
Our lead time:
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