Big soldering area: 400*600mm, infrared and hot air heating technology, make temperature more accurate and evenness. Fuzzy temperature control technology, visualization drawer, can see the whole soldering process very clearly.
FEATURES
(1) large infrared soldering area: 400*600mm
(2)Eight soldering temperature waves
Parameters of eight soldering waves are predefined and the entire soldering process can completed
automatically from Preheat, Soak and Reflow through to cool down.
(3) Special heat up and temperature equalization with all designs
Uses up to 1500 Watts of energy efficient Infrared heating and air circulation to re-flow solder.
(4) Ergonomic design, practical and easily operated
(5) Large number of available functions
The T962C can solder single and double-sides PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.
