Laminate material: FR-4, FR-1 and CME-1
Surface finish: OSP, HAL, gold finger, silver, nel plating, immersion and soft Au
Test voltage: 150 to 300V
Copper thickness: 0.5 to 10 ounces
Base board thickness: 0.3 to 4.0mm
Twist: 0.5%
Finished board area: 560 x 610mm
Copper thickness in hole: 25Ω
Minimum line width and spacing: 0.1mm
Minimum pad diameter inner layer: 0.5mm
Minimum hole diameter: 0.25mm
Layers:
Single
Double
4 to 10
Hole tolerance:
PTH: +0.075mm
NPTH: +0.05mm
Hole location tolerance: +0.075mm
Profile tolerance:
CNC routing: +0.15
CNC punching: +0.15
Solder mask bridge ability: 0.1mm
Solder mask rigidity: 6H
Solderer test: 245C 5 seconds
Packing:
Inner: vacuum/plastic
Outer: standard carton
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PCB Assembly with 150 to 300V Test Voltage, EMS
PCB Assembly with 150 to 300V Test Voltage, EMS
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