Number of layers: single-layer, double-layer and 4 to 10
Copper thickness: 0.5 to 10oz
Laminate material: FR-4, FR-1 and CME-1
Base board thickness: 0.3 to 4.0mm
Surface finishing: OSP, HAL, immersion AU, silver, soft Au, nickel plating and gold finger
560 x 610mm finished area
Twist: 0.5%
Insulation resistance: 10 or 11MΩ
Test voltage: 150 to 300V
Thermal cycling ability 288C, 5 seconds
Finished board area: 560 x 610mm
Minimum line width and spacing: 0.1/0.1mm
Copper thickness in hole: 25.0μm
Minimum pad diameter inner layer: 0.5mm
Minimum hole diameter: 0.25mm
Hole tolerance:
PTH: +0.075mm
NPTH: +0.05mm
Hole location tolerance: +0.075mm
Profile tolerance CNC routing: +0.15mm
Profile tolerance CNC punching: +0.15mm
Solder mask bridge ability: 0.1mm
Solder mask rigidity: 6H
Solderable test: 245C, 5 seconds
Packing:
Inner: vacuum/plastic
Outer: standard carton
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PCB Assembly with 6H Solder Mask Rigidity and 0.5% Twist, EMS, Turnkey Service
PCB Assembly with 6H Solder Mask Rigidity and 0.5% Twist, EMS, Turnkey Service
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