Printed Circuit Board High Frequency Multilayer PCB Copper With Peelable Soldermask
Specification:
Board size: 6*6 cm
Layer: 4
Model: XCEH
Board thickness: 1.8mm
Copper foil: 35UM
Material: Rogers
Parameter:
| Annual stock meterial | Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free | ||||||||
| Layer No. | 1-16 | ||||||||
| Min board thickness | 2 layer 0.2mm | ||||||||
| 4 layer 0.4mm | |||||||||
| 6 layer 0.6mm | |||||||||
| 8 layer 0.8mm | |||||||||
| 10 layer 1.0mm | |||||||||
| Max panel size | 508*610mm | ||||||||
| Board thickness toleranceT≥0.8mm±8%,T0.8mm±5% | |||||||||
| Wall hole copper thickness | 0.025mm(1mil) | ||||||||
| Finished hole | 0.2mm-6.3mm | ||||||||
| Min line width | 4mil/4mil(0.1/0.1mm) | ||||||||
| Min bonding pad space | 0.1mm(4mil) | ||||||||
| PTH aperture tolerance | ±0.075mm(3mil) | ||||||||
| NPTH aperture tolerance | ±0.05mm(2mil) | ||||||||
| Hole site deviation | ±0.05mm(2mil) | ||||||||
| Profile tolerance | ±0.10mm(4mil) | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | 1012Ωnormal | ||||||||
| Through-hole resistance | 300Ωnormal | ||||||||
We equipped with advance Processing Equipments and Measurement Techniques, such as: High Pecision CNC Drilling Machines, AOI Tester, German Flying Probe Testers and other advanced equipments, and High Frequency Board manufacturing, Special Impedance Control, Buried & Blind Via manufacturing, Flying Probe Test techniques.
