DK = 3.38 Rogers 4003C RF / Microwave PCB Circuit Boards Maker
Technology:
|
Material |
FR4(standard) |
Isola |
|
FR4(Hi-Tg) |
Isola / Nanya / ITEQ |
|
|
Rogers |
RO4003 /4350 /3010 /RT Duroid 5880 / 5870 |
|
|
Arlon |
Diclad 25N / 25FR / 870 / 880 |
|
|
Taconic |
TLY / TLC / RF35 / RF30 |
|
|
GETEK |
RG200D / ML200D |
|
|
Aluminum PCBs |
Di-electric materials : FR4 / Bergquist / Rogers / Thermagon |
|
|
Copper weight |
1 ~ 5 oz internal & external layers |
|
|
Drilling |
Min. Drilled Hole Size |
10 mil ( 6 ~ 8 mil finished) |
|
Annular Ring |
5 mil(normal) / 4 mil (for Laser vias) |
|
|
Registration |
± 3 mil |
|
|
Max. Aspect Ratio |
10 :1 |
|
|
Hole Size Tolerance |
+/- 3 mils (PTH) ; +/- 2 mils (N-PTH) |
|
|
Hole Roughness |
< 0.8 mil |
|
|
Min. Cu Plating in Holes |
> 0.8mil, Ave. 1 mil |
|
|
Laser drill |
available |
|
|
Image Transfer |
Min. Trace and space |
4 / 4 mil |
|
SMT / BGA.Pitch |
10 mils for SMT / 30 mils for BGA |
|
|
Trace/space Tolerance |
± 20% (or +/- 10% per IPC class 3) |
|
|
Solder Mask |
LPI Solder Mask |
Green(glossy or matte), Blue, Red, Black, Yellow |
|
Via Plugging |
min. 80% filled |
|
|
Solder Mask ink |
Taiyo & Tamura |
|
|
Registration |
± 2 mil |
|
|
Min Solder Dam |
2.5 mil |
|
|
Thickness |
0.5 ~1.5 mil |
|
|
Silkscreen |
White, Yellow, Black |
|
|
Min. silkscreen width |
8 mil |
|
|
CNC Dimension |
± 5 mil |
|
|
Punch Dimension |
± 4 mil |
|
|
Blind Vias / Buried Vias |
Yes |
|
|
VIP (Via in Pad) |
Yes (Non-conductive epoxy resin-filled or Cu filled) |
|
|
Impedance control |
|
± 10% |
|
Surface Finish |
HASL |
200 ~ 500 μ" |
|
Pb free HASL |
100 ~ 500 μ" |
|
|
Immersion Gold |
1 ~ 5 μ" |
|
|
Immersion Silver |
6 ~ 12 μ" |
|
|
Immersion Tin |
25 ~ 40 μ" |
|
|
Electolytic Gold |
Yes |
|
|
Gold Finger Plating |
5 ~ 40 μ" |
|
|
OSP(Entek) |
yes |
|
|
Solder Mask Coating Method |
Silkscreen printing (Double or triple coatings available) |
|
|
Carbon Ink |
20 Ω |
|
|
Peelable mask |
Thickness = 0.3 mm |
|
|
Pumice Pre-treatment |
Available |
|
