Brass PVD Metallization on Alumnium Plate / Al plate metalization with Cu Thin Conductive Film
Aluminum plate coated with Copper material to get a thin conductive film. PVD metallization technology is properly used for this application.
Sputtering Materials for conductive films: Cu (Copper), Ni (Nickel), Ag (silver) based on different coating recipes and coating processes requirement.
PVD sputtering metallization gives a combination of advantages like no other:
It is totally economically efficient generating the thinnest and most uniform coating films;
It is a dry coating process at low temperature in a vacuum chamber;
It offers great versatility, can be used for the deposition of conductive or non-conductive materials on any
type of substrates, like: metals, ceramics, plastic materials.
Multi layers coating are available.
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Vakia-MSC PVD Planar Magnetron Sputtering Coating System |
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Model |
MSC-800 |
MSC-900 |
MSC-1008 |
MSC-1250 |
MSC-1400 |
MSC-1600 |
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Chamber Inner size(mm) |
800x800 |
900x900 |
1000x800 |
1250x1250 |
1400x1600 |
1600x1600 |
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Power Supplies |
Pulsed bias supply, DC power supply, MF power supply, RFmagnetron supply |
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Chamber Type |
Vertical cylindrical model, double doors/single door |
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Chamber Material |
SUS304 |
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Ultimate Vacuum |
6.0×10-4Pa |
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Vacuum Evacuation |
From 1 atmosphere to 8.0×10-3Pa≤10min |
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Vacuum Pump System |
diffusion pump/ molecular pump+ roots pump + mechanical pump + holding pump |
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Sputtering Sources |
Sputtering targets |
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magnetron power supply |
10KW/unit |
20KW/unit |
20KW/unit |
30KW/unit |
40KW/unit |
50KW/unit |
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Driving System |
planetary driving, central driving |
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Cooling |
Cooling water, with cooling tower or cryopump, Polycold assisted facilities |
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Operation System |
manual / automatic , touch screen , PLC or IPC system |
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Please contact us today, Vakia Vacuum Coating is honored to be your your business partner.
