High Conductive RA Red Copper Foil With Thickness From 10μm To 150μm
Specification:
Rolled Copper Foil has extraordinary strength, bendability, ductility and lustrous surface,
plus its excellent mechanical capacity, makes it irreplaceable as a raw material.
Base Material: C11000 Copper, Cu > 99.90%
Thickness Range: 0.0004inch~0.006inch (0.01mm-0.15mm)
Width Range: 0.16inch~16inch (4mm-400mm)
Temper: Hard, Quarter Hard, Half Hard, Soft
Application: Transformer, Copper Flexible Connector, CCL, FCCL, PCB, Geothermal Film, Construction,
Decoration.
|
GB |
ALLOY NO. |
SIZE (mm) |
||||
|
(ISO) |
(ASMT) |
(JIS) |
(BIS) |
(DIN) |
||
|
T2 |
Cu-ETP |
C11000 |
C1100 |
C101 |
R-Cu57 |
Thickness: 0.01-0.15/Max Width: 400 |
|
TU2 |
Cu-OF |
C10200 |
C1020 |
Cu-OFC |
OF-Cu |
|
Mechanical Properties:
|
Temper |
JIS Temper |
Tensile Strength Rm/N/mm 2 |
Elongation A50/% |
Hardness HV |
|
M |
O |
220~275 |
≥ 15 |
50~70 |
|
Y4 |
1/4H |
240~300 |
≥ 9 |
65~85 |
|
Y |
H |
330~450 |
- |
100~140 |
|
T |
EH |
380~510 |
- |
- |
Note: We can provide products with other properties according to customers` requirements.
Physical Properties :
Density: 8.9g/cm3
Electrical conductivity (20°C): min 90%IACS for annealed to temper
min 80%IACS for rolled to temper
Thermal conductivity (20°C): 390W/(m°C)
Elastic modulus: 118000N/m
Softening temperature: ≥380°C
Sizes and Tolerances (mm)
|
Thickness |
Thickness Tolerances |
Width |
Width Tolerances |
|
0.01~0.015 |
± 0.002 |
4~250 |
± 0.1 |
|
> 0.018~0.10 |
± 0.003 |
4~400 |
|
|
> 0.10~0.15 |
± 0.005 |
4~400 |
Specifications Available (mm)
|
Thickness |
Width |
Temper |
|
0.01~0.015 |
4250 |
O,H |
|
> 0.018~0.10 |
4400 |
O,H |
|
> 0.10~0.15 |
4400 |
O,1/4H,1/2H,H |
Carried Standard(Latest)
|
Nations |
Standard No. |
Standard Name |
|
China |
GB/T2059--2000 |
CHINA’S NATIONAL STANDARD |
|
Japan |
JIS H3100 :2000 |
COPPER AND COPPER ALLOY SHEETS,PLATES AND STRIPS |
|
U.S.A |
ASTM B36/B 36M -01 |
STANDARD SPECIFICATION FOR BRASS,PLATE, |
|
Germany |
DIN-EN 1652:1997 |
COPPER AND COPPER ALLOYS PLATE,SHEET, |
|
DIN-EN 1758 :1997 |
COPPER AND COPPER ALLOYS STRIP FOR LEADFRAMES |
|
|
SEMI |
SEMI G4-0302 |
SPECIFICATION FOR INTERGRATED CIRCUIT L |
Application
