Fine Pitch BGA Assembly Circuit Board 18 Layer Impedance Controlled PCB Via In Pad
PCB properties
| PCB SIZE | 120 x 122mm=1PCS=1design |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 18 layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- TOP 17um(1oz)+plate |
| 65 um prepreg 1080 x 1 | |
| copper ------- L02 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L03 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L04 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L05 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L06 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L07 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L08 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L09 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L10 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L11 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L12 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L13 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L14 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L15 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L16 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L17 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- BOT 17um(0.5oz)+plate | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4.5mil/4.5mil |
| Minmum / Maximum Holes: | 0.3/5.0mm |
| Number of Different Holes: | 16 |
| Number of Drill Holes: | 5619 |
| Number of Milled Slots: | 5 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | Single Trace Impedance Control, L1,L18, Track 10mil, 50Ohm. Differential Pairs Impedance Control, L1, L5, L10, L12, L18 Track/Space 4.5mil / 4.5mil, 95Ohm |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | IT180A, FR-4 TG170, er<5.4, ITEQ Supplied |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 2.5mm ±0.2 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold 0.05µm over 3µm Nickel (12.2% area) |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000 GT600D, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), Via In Pad under BGA, Epoxy Resin Via plugging |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | Radio communication |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
a) High temperature PCB. Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260
b) Excellent thermal reliability and CAF resistance providing long-term reliability for industrial and automobile application.
c) PCB manufacturing on required specifications. Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.
d) ISO certified PCB manufacturing factory.
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PCB knowledge: The components of multilayer PCB --- copper foil
A multilayer board consists of copper foils, thin rigid laminates and prepreg sheets.
The standard thicknesses for copper foils are shown below
