DR-QG8G diamond laser cutting machine is specially designed equipment for the diamond-cutting, fast cutting speed, high production efficiency, low loss, its simple operation of software is efficient and time-saving . The automatic DR-QG8G ultraviolet laser diamond laser cutting machine use ultraviolet laser machine with high-power 355nm as a light source,ultraviolet beam focused spot is extremely small, it can achieve ultra-fine cutting. ultraviolet laser processing is a "cold processing", "cold" cutting leads to few place that heat affect, and there is no stress in the grain with the processing of non-contact manner so the production yield of crystal grain cutted is high,the parameters of electrical performance is much better than mechanical cutting . As High-precision, automated system configuration , it is better than mechanical cutting methods at the cutting speed, material utilization, cost and so on. ultraviolet laser machine with High Power 355nm ; high precision two-dimensional platform; high-precision rotating platform; automatic delivery and discharge device; high precision CCD imaging control system; gas cooling system is more convenient than water cooling method of the mechanical cutting ,and it also makes the useage cost lown
Good quality of Laser beam, small focus spot, narrow cutting gap, high processing speed, smal heat affected zone ; cutting gap is flat smooth, no cracks, high yield; high productivity, close cutting gap, high utilization of silicon area. Automatic delivery discharge, automatic image processing, without manual operation.High cutting speed, high efficiency and precision. Non-contact processing, without supplies, low cost of usage and maintenance costs. The whole process is controlled by computer software, it is easy to operate,and it can give the feedback of abnormal signal . The performance of machine is stable,and it can be used for a long time.
materials applicated and industrial applications
Mainly used for scribing and cutting of diamond, sapphire; it also applies to the scribing and fine processing of thin ceramics, silicon wafers, IC die, the polymer films and other materials.
Specifications
Laser wavelength 532 nm
Beam divergence angle ≤ 2.0mrad
Cutting width 10-30μm
Cutting depth of 10-40μm
Cutting width precision of ± 2μm
Cutting accuracy ± 2μm
Cutting a straight line accuracy of ± 5μm
Cutting straight-line speed 0-300 mm / s
Range of processing 300mm × 300mm
Rated input voltage single-phase AC 220V ± 10%, 50 Hz/60Hz, with protection of ground (such as voltage fluctuation is too large to be equipped with voltage regulator)
Maximum input power 2 kW
Size 1300 mm x 710 mm x 1400 mm
Cooling oil-cooling
