The SSP series of spherical fused silica powder have a mono-dispersed, surface smoothness, good fluidity, low coefficient of thermal expansion characteristics which can be widely used in the electronic packaging, chip packaging, photovoltaic cell chip packaging, special engineering plastic products, inks, paints, pigments, daily chemical products and so on.
2. Main Specifications
SiO2 Purity: 99.95% min.
Size: D50, 1-10um per the user's demands.
3. Type and Typical Data
ITEM | UNIT | SSP - 10 | SSP- 7 | SSP- 4 | SSP – 2.5 | SSP- 1 |
Size: D50 | µm | 10±2 | 7.0±1 | 4.0±1 | 2.5±0.5 | 1.0±0.5 |
Size: Dmax | 45 | 30 | 15 | 10 | 5 | |
SiO2 content | % | 99.95 | 99.95 | 99.95 | 99.95 | 99.95 |
H2O content | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | |
percent of spheroidization | >98 | >98 | >98 | >98 | >98 | |
Specific surface area | M2g-1 | 1.0 | 1.5 | 1.7 | 1.9 | 9.0 |
Na | ppm | <10 | <10 | <10 | <10 | <10 |
K | <2 | <2 | <2 | <2 | <2 | |
Ca | <3 | <3 | <3 | <3 | <3 | |
Mg | <1 | <1 | <1 | <1 | <1 | |
Al | <50 | <50 | <50 | <50 | <50 | |
Fe | <10 | <10 | <10 | <10 | <10 | |
Ti | <10 | <10 | <10 | <10 | <10 | |
As | <1 | <1 | <1 | <1 | <1 | |
P | <1 | <1 | <1 | <1 | <1 | |
Cr | <1 | <1 | <1 | <1 | <1 | |
Mn | <1 | <1 | <1 | <1 | <1 | |
Ni | <1 | <1 | <1 | <1 | <1 | |
Cu | <1 | <1 | <1 | <1 | <1 | |
Mo | <1 | <1 | <1 | <1 | <1 | |
U | ppb | <0.3 | <0.3 | <0.3 | <0.3 | <0.3 |
4.Packing:
Packing by brown paper drum with 25kg net per drum (25Kg/Drum) or 25Kg net per pp bag within plastic inner bag.
