Output Control Tg 170 18 Layer Via In Pad PCB Controlled Impedance
PCB properties
| PCB SIZE | 79 x 81mm=1PCS=1design |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 18 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- TOP 17um(1oz)+plate 25um |
| 65 um prepreg 1080 x 1 | |
| copper ------- L02 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L03 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L04 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L05 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L06 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L07 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L08 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L09 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L10 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L11 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L12 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L13 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L14 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L15 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L16 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L17 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- BOT 17um(0.5oz)+plate 25um | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5mil/5mil |
| Minmum / Maximum Holes: | 0.3/2.0mm |
| Number of Different Holes: | 12 |
| Number of Drill Holes: | 6720 |
| Number of Milled Slots: | 4 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | Differential pairs impedance: L3, 4 / 4 mil, 91ohm +/-10%; L4, 4 / 6 mil, 97ohm +/-10%; Single trace impedance: L3 / L4 / L7 / L8, 5mil, 56ohm +/-10%; L3 / L4 / L7, 6mil, 49ohm +/-10% |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-180, TG>170, er<5.4 |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 2.5mm ±10% |
| PLATING AND COATING | |
| Surface Finish | Electroless Nickle over Immersion Gold (ENIG)( 0.05µm over 3µm nickle) |
| Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Green, PSR-2000GT600D, Taiyo supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented. Vin in pad under BGA package |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | Output control |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
a) Industrial standard material with high Tg (175 by DSC) and excellent thermal reliability.
b) ITEQ IT-180. Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260
c) Excellent thermal reliability and CAF resistance providing long-term reliability for industrial and automobile application.
d) No minimum order quantity. 1-10 pieces are offered for sale.
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How to specify a PCB?
A PCB user generally needs to present all of the primary manufacturing data in a complete and unambiguous way that the PCB manufacturer can quote and produce the boards without error.
A checklist is listed as follows. Some parameters not necessary for a particular job can be deleted so that the specification form only reflects the relevant data.
(1) Company name
(2) Part number
(3) Lot size and annual requirements
(4) Layer count
(5) Board size
(6) Board thickness
(7) Board shape
(8) Panelization
(9) Board build-up
(10) Boards with controlled impedance
(11) Test coupon
(12) Machining (Contouring)
(13) Laminate type and UL flammability
(14) Warp & Twist
(15) Outer layers
(16) Inner layers
(17) Solderability preservation
(18) Solder masks
(19) Notation
(20) Peelable solder mask
(21) Carbon printing
(22) Plated through holes (PTHs)
(23) Non-PTHs
(24) Milled Holes (Slots)
(25) Blind via holes
(26) Buried via holes
(27) Board tooling holes
(28) Panel tooling holes
(29) Board mounting
(30) Edge connectors
(31) Soldering conditions
(32) Markings
(33) Electrical test
(34) Automatic optical inspection
(35) Minimum pattern conditions
(36) Quality conditions
FAQ
Do you sell cheap FR-1, CEM-1 PCB?
Yes, we just offer single sided PCB made of FR-1 and CEM-1. We also use punching tool for the contour for the mass production.
